GIGABYTE B760M DS3H AX DDR4 اللوحه الام

• CPU

  1. LGA1700 socket: Support for the 13th and 12th Generation Intel^® Core™, Pentium^® Gold and Celeron^® بروسيسور
  2. L3 cache varies with CPU

  (Please refer “CPU Support List” for more information.)

• Chipset

  1. Intel^® B760 Express Chipset

• Memory

  1. Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules
  2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
  3. Dual channel memory architecture
  4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
  5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
  6. Support for Extreme Memory Profile (XMP) memory modules

  (Please refer “Memory Support List” for more information.)

• Onboard Graphics

  Integrated Graphics Processor-Intel^® HD Graphics support:

  1. 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
     * Support for HDMI 2.0 version and HDCP 2.3.
  2. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
     * Support for DisplayPort 1.2 version and HDCP 2.3
  3. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
     * Support for DisplayPort 1.2 version.

  (Graphics specifications may vary depending on CPU support.)

  Support for up to triple-display at the same time

• Audio

  1. Realtek^® Audio CODEC
  2. High Definition Audio
  3. 2/4/5.1/7.1-channel
     * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
  4. Support for S/PDIF Out

• LAN

  1. Realtek^® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)

• Wireless Communication module

  AMD Wi-Fi 6E RZ608 (MT7921K) (For PCB rev. 1.0)

  1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
  2. LUETOOTH 5.2
  3. Support for 11ax 80MHz wireless standard and up to 1.2 Gbps data rate

  Intel^® Wi-Fi 6E AX210 (For PCB rev. 1.1)

  1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
  2. BLUETOOTH 5.3
  3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

  Intel^® Wi-Fi 6E AX211 (For PCB rev. 1.2)

  1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
  2. BLUETOOTH 5.3
  3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

  Realtek^® Wi-Fi 6E RTL8852CE (For PCB rev. 1.3)

  1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
  2. BLUETOOTH 5.3
  3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

  (Actual data rate may vary depending on environment and equipment.)

• Expansion Slots

  CPU:

  1. 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16

  Chipset:

  1. 2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1

• Storage Interface

  CPU:

  1. 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

  Chipset:

  1. 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
  2. 4 x SATA 6Gb/s connectors

  RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices

• USB

  Chipset:

  1. 1 x USB Type-C^® port on the back panel, with USB 3.2 Gen 2 support
  2. 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
  3. 2 x USB 2.0/1.1 ports on the back panel

  Chipset+2 USB 2.0 Hubs:

  1. 4 x USB 2.0/1.1 ports available through the internal USB headers

• Internal I/O Connectors

  1. 1 x 24-pin ATX main power connector
  2. 1 x 8-pin ATX 12V power connector
  3. 1 x CPU fan header
  4. 3 x system fan headers
  5. 1 x addressable LED strip header
  6. 1 x RGB LED strip header
  7. 2 x M.2 Socket 3 connectors
  8. 4 x SATA 6Gb/s connectors
  9. 1 x front panel header
  10. 1 x front panel audio header
  11. 1 x USB 3.2 Gen 1 header
  12. 2 x USB 2.0/1.1 headers
  13. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
  14. 1 x S/PDIF Out header
  15. 1 x Q-Flash Plus button
  16. 1 x reset button
  17. 1 x reset jumper
  18. 1 x Clear CMOS jumper

• Back Panel Connectors

  1. 2 x USB 2.0/1.1 ports
  2. 1 x PS/2 keyboard/mouse port
  3. 2 x SMA antenna connectors (2T2R)
  4. 1 x HDMI port
  5. 2 x DisplayPorts
  6. 3 x USB 3.2 Gen 1 ports
  7. 1 x USB Type-C^® port, with USB 3.2 Gen 2 support
  8. 1 x RJ-45 port
  9. 3 x audio jacks

• I/O Controller

  1. iTE^® I/O Controller Chip

• H/W Monitoring

  1. Voltage detection
  2. Temperature detection
  3. Fan speed detection
  4. Water cooling flow rate detection
  5. Fan fail warning
  6. Fan speed control
     * Whether the fan speed control function is supported will depend on the cooler you install.

• BIOS

  1. 1 x 128 Mbit flash
  2. Use of licensed AMI UEFI BIOS
  3. PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

• Unique Features

  1. Support for GIGABYTE Control Center (GCC)
     * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
  2. Support for Q-Flash
  3. Support for Q-Flash Plus

• Bundled Software

  1. Norton^® Internet Security (OEM version)
  2. LAN bandwidth management software

• Operating System

  1. Support for Windows 11 64-bit
  2. Support for Windows 10 64-bit

• Form Factor

  1. Micro ATX Form Factor; 24.4cm x 24.4cm

GIGABYTE B760M DS3H AX DDR4 Motherboard