Intel Core I9 13900K Processor
28900 جنية
- 24 cores (8 P-cores + 16 E-cores) and 32 threads. Integrated Intel UHD Graphics 770 included
- Performance hybrid architecture integrates two core microarchitectures, prioritizing and distributing workloads to optimize performance
- Up to 5.8 GHz unlocked. 36M Cache
- Compatible with Intel 600 series and 700 series chipset-based motherboards
- Turbo Boost Max Technology 3.0, and PCIe 5.0 & 4.0 support. Intel Optane Memory support. No thermal solution included
غير متوفر
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Product Collection
Vertical Segment
Desktop
Processor Number
i9-13900K
Status
Launched
Lithography
Intel 7
Use Conditions
PC/Client/Tablet, Workstation
CPU Specifications
Total Cores
24
# of Performance-cores
8
# of Efficient-cores
16
Total Threads
32
Max Turbo Frequency
5.80 GHz
Intel® Thermal Velocity Boost Frequency
5.80 GHz
Intel® Turbo Boost Max Technology 3.0 Frequency ‡
5.70 GHz
Performance-core Max Turbo Frequency
5.40 GHz
Efficient-core Max Turbo Frequency
4.30 GHz
Performance-core Base Frequency
3.00 GHz
Efficient-core Base Frequency
2.20 GHz
Cache
36 MB Intel® Smart Cache
Total L2 Cache
32 MB
Processor Base Power
125 W
Maximum Turbo Power
253 W
Supplemental Information
Embedded Options Available
No
Memory Specifications
Max Memory Size (dependent on memory type)
128 GB
Memory Types
Up to DDR5 5600 MT/s
Up to DDR4 3200 MT/s
Up to DDR4 3200 MT/s
Max # of Memory Channels
2
Max Memory Bandwidth
89.6 GB/s
ECC Memory Supported ‡
Yes
Processor Graphics
Processor Graphics ‡
Intel® UHD Graphics 770
Graphics Base Frequency
300 MHz
Graphics Max Dynamic Frequency
1.65 GHz
Graphics Output
eDP 1.4b, DP 1.4a, HDMI 2.1
Execution Units
32
Max Resolution (HDMI)‡
4096 x 2160 @ 60Hz
Max Resolution (DP)‡
7680 x 4320 @ 60Hz
Max Resolution (eDP – Integrated Flat Panel)‡
5120 x 3200 @ 120Hz
DirectX* Support
12
OpenGL* Support
4.5
OpenCL* Support
3.0
Multi-Format Codec Engines
2
Intel® Quick Sync Video
Yes
Intel® Clear Video HD Technology
Yes
# of Displays Supported ‡
4
Device ID
0xA7803
CORE I9 13900K
Expansion Options
Direct Media Interface (DMI) Revision
4.0
Max # of DMI Lanes
8
Scalability
1S Only
PCI Express Revision
5.0 and 4.0
PCI Express Configurations ‡
Up to 1×16+4, 2×8+4
Max # of PCI Express Lanes
20
Package Specifications
Sockets Supported
FCLGA1700
Max CPU Configuration
1
TJUNCTION
100°C
CORE I9 13900K
Advanced Technologies
Intel® Gaussian & Neural Accelerator
3.0
Intel® Thread Director
Yes
Intel® Deep Learning Boost (Intel® DL Boost)
Yes
Intel® Speed Shift Technology
Yes
Intel® Thermal Velocity Boost
Yes
Intel® Turbo Boost Max Technology 3.0 ‡
Yes
Intel® Turbo Boost Technology ‡
2.0
Intel® Hyper-Threading Technology ‡
Yes
Intel® 64 ‡
Yes
Instruction Set
64-bit
Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Idle States
Yes
Enhanced Intel SpeedStep® Technology
Yes
Thermal Monitoring Technologies
Yes
Intel® Volume Management Device (VMD)
Yes
CORE I9 13900K
Security & Reliability
Intel® Standard Manageability (ISM) ‡
Yes
Intel® Control-Flow Enforcement Technology
Yes
Intel® AES New Instructions
Yes
Secure Key
Yes
Intel® OS Guard
Yes
Intel® Trusted Execution Technology ‡
Yes
Execute Disable Bit ‡
Yes
Intel® Boot Guard
Yes
Mode-based Execute Control (MBEC)
Yes
Intel® Stable IT Platform Program (SIPP)
Yes
Intel® Virtualization Technology with Redirect Protection (VT-rp) ‡
Yes
Intel® Virtualization Technology (VT-x) ‡
Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
Intel® VT-x with Extended Page Tables (EPT) ‡
Yes
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العلامة التجارية
انتل
INTEL Our Purpose
INTEL We create world-changing technology that improves the life of every person on the planet.put the silicon in Silicon Valley. For more than 50 years,our people have had a profound influence on the world, driving business and society forward by creating radical innovation that revolutionizes the way we live.Today we are applying our reach, scale, and resources to enable our customers to capitalize more fully on the power of digital technology. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges.
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