Klevv Fit V 32GB 2x16GB DDR5 6400MHz CL30 Jet Black Desktop
26250 EGP
- Part Number KD5AGU880-64B300L
- Capacity 32GB (2 x 16GB)
- Type DDR5 (288-pin UDIMM)
- Tested Speed 6400 MT/s
- Tested Latency 30-38-38-78 (CL30)
- OC Profiles Intel® XMP 3.0 & AMD EXPO™
- Height 33.21 mm (Ultra-low Profile)
- Warranty 3 Years
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Klevv Fit V 32GB 2x16GB DDR5 6400MHz CL30 Jet Black Desktop Memory
In short, the Klevv Fit V 32GB 2x16GB DDR5 6400MHz CL30 Jet Black Desktop Memory technically facilitates a superior computing environment through its cost-efficient next-gen performance and ultra-low profile architecture. Notably, the KLEVV architecture utilizes strictly selected superior quality ICs, without mixing memory IDM, to effectively guarantee unparalleled reliability. Specifically, the integration of high frequencies up to 6400MT/s in this Desktop Ram reinforces structural synchronization for intensive graphics rendering and video editing applications near-instantaneously.
Furthermore, the aluminum heat spreader effectively supports extreme thermal dissipation despite its minimalist 33.2mm clearance. Because the hardware supports Intel® XMP 3.0 and AMD EXPO™ profiles, it technically facilitates elite one-click overclocking excursions across both Intel and AMD platforms. Consequently, the FIT V delivers a disciplined industrial-grade power supply through its built-in PMIC and on-die ECC. As a result, you receive a visually perfect housing for your next-gen content creation build.
Next-Gen Thermal & Hardware Synchronization
Ultra-Low Profile Mastery
Notably, the FIT V architecture specifically utilizes a 33.2mm clearance design. This technically allows for extreme compatibility with larger air coolers and compact chassis while effectively acting as a secondary signal bridge. Consequently, your technical presence remains fluid during high-load creative iterations.
Built-in AI & Data Reliability
Moreover, the integrated On-die ECC and PMIC effectively support extreme stability for modern AI-driven workstations. This architecture ensure your high-performance hardware transitions remain stable while maintaining structural synchronization for enthusiast builds.
💡 Pro-Builder Tip: KLEVV FIT V Optimization
To clarify, the FIT V technically facilitates one-click overclocking via Intel XMP 3.0 and AMD EXPO profiles. Specifically, ensure you enable the profile in your BIOS to effectively maintain synchronization with 6400MT/s speeds. Furthermore, ensure you utilize the low 33.2mm height to ensure your high-end cooling solutions maintain maximum airflow efficiency near-instantaneously.
Technical Specs
| Hardware Feature | Detailed Specification |
|---|---|
| Format | 288 Pin DDR5 Unbuffered DIMM |
| Color | Jet Black |
| Tested Speed | 6400 MT/s |
| Capacity | 32GB (16GB x 2) |
| Tested Timing | 30-38-38-78 |
| Tested Voltage | 1.35V |
| SPD Speed | 4800 MT/s |
| SPD Timing | 40-40-40-77 |
| SPD Voltage | 1.1V |
| Profile Support | Intel XMP 3.0, AMD EXPO |
| Dimension (LxWxH) | 136.34 x 33.21 x 6.2 mm |
| Model Name | Klevv Fit V 32GB 2x16GB DDR5 6400MHz Jet Black |
| Part Number | KD5AGU880-64B300L |
| SKU | KD5AGU880-64B300L |
| UPC | N/A |
| EAN | 4895194969013 |
| Local Warranty | 3 Year Local Warranty |
What’s In The Box
Frequently Asked Questions
What is the benefit of the FIT V’s ultra-low clearance?
Notably, the 33.2mm height technically facilitates a seamless visual transition into builds with large CPU air coolers. Specifically, it provides extensive compatibility for diversified configurations. Consequently, your setup maintains industrial-grade alignment near-instantaneously.
Does KLEVV FIT V support both Intel and AMD systems?
Yes, the memory technically facilitates stability via support for both Intel XMP 3.0 and AMD EXPO profiles. Furthermore, it is optimized for the latest AMD Ryzen 9000 series. Therefore, you can execute elite-tier creative tasks while maintaining structural synchronization.
*KLEVV and the KLEVV logo are registered trademarks of Essencore Limited. Intel, XMP, AMD, and EXPO are trademarks of their respective owners. Technical specifications are based on official documentation provided at the time of publication.
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