Team Group Vulcan Z Gray 16Gb 3600 Desktop Memory

✅ Authorized Team Group Partner in Egypt | Official Warranty Coverage | Expert PC Building Consultation Available

⚡ Engineering Highlights at a Glance:

• 16GB Dual-Channel Kit (2x8GB): Ample capacity for gaming and general productivity workloads.
• DDR4-3600 MHz Speed: High-frequency performance for improved bandwidth and responsiveness.
• CL18 Latency: 18-22-22-42 timing at 1.35V for fast response times.
• XMP 2.0 Support: One-click overclocking to reach the rated 3600MHz speed on compatible Intel and AMD platforms.
• Reinforced Aluminum Heat Spreader: 0.8mm thick, one-piece alloy aluminum with electrolytic anodizing for corrosion resistance.
• High Thermal Conductive Adhesive: Maintains gaming memory within operating temperatures.
• Selected High-Quality ICs: Every chip is selected through rigorous testing for stability and compatibility.
• Lifetime Warranty: Backed by a lifetime warranty for long-term peace of mind.

Platform Compatibility

The Team Group T-Force Vulcan Z is a DDR4 memory kit designed for desktop motherboards with DDR4 slots. It is not compatible with DDR5 or DDR3 platforms. The kit supports Intel XMP 2.0 for one-click overclocking on compatible Intel and AMD platforms. Before purchasing, check the QVL (Qualified Vendor List) provided by the motherboard manufacturer to confirm compatibility. The final operating frequency depends on system BIOS settings, motherboard, and CPU compatibility.

🔧 Installation and Configuration

This is a dual-channel kit (2x8GB) designed to be installed in matched pairs. Install both modules in the recommended slots (typically A2 and B2) per your motherboard manual to enable dual-channel operation. If XMP 2.0 is not enabled, the memory will run at the SPD default frequency (JEDEC standard), such as DDR4-2133 or 2400. Enable XMP 2.0 in BIOS to run at the rated 3600MHz speed. Some motherboards may not reach the stated frequency; the final operating frequency depends on system settings and hardware specifications.

💡 Thermal Management and Design

The reinforced aluminum heat spreader is formed by a punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. The electrolytic anodizing process enhances corrosion resistance and makes the surface non-conductive. The superconductive thermal adhesive maintains gaming memory within operating temperatures. The voltage is 1.35V, higher than standard DDR4’s 1.2V, providing stability at high frequencies. Do not mix memory modules of different capacities, frequencies, brands, or models, as mixing different kits may cause system instability or failure to boot.

Install both modules in the recommended dual-channel slots (typically A2 and B2) per your motherboard manual. Enable XMP 2.0 in BIOS to run the kit at 3600MHz with 18-22-22-42 timing. If your system is unstable at 3600MHz, try lowering the frequency manually or revert to BIOS default settings. Verify your motherboard’s QVL to confirm compatibility at the rated speed. The reinforced aluminum heat spreader with thermal conductive adhesive provides efficient heat dissipation for high-frequency operation. The gray color matches many build aesthetics. The lifetime warranty provides long-term peace of mind. This kit is well-suited for gamers and enthusiasts who want a balance of speed, reliability, and value in a DDR4 platform.