Thermalright TF9 1.5g Thermalpaste

Thermalright TF9 1.5g Thermalpaste

Thermalright TF9 1.5g Thermalpaste SPECIFICATIONS:

• Thermal Conductivity (W/m-k) : 14
• اللون : Gray
• Thermal Impedance (℃-cm²/W) : <0.01
• Specific Gravity (25℃) : 2.9
• Useable Temperature Range : -220℃ to 380℃
• Content : 1.5g
• Electrically Conductive : No
• Harmless : Yes

• Thermal Conductivity (W/m-k): 14
  • A thermal conductivity of 14 W/m-k indicates that this material is highly efficient at transferring heat. This value is excellent for thermal pads or compounds, making it suitable for high-performance cooling applications.
• Color: Gray
  • The gray color is typical for thermal materials and often signifies the presence of compounds like silicone or metal-based fillers that enhance heat dissipation.
• Thermal Impedance (℃-cm²/W): <0.01
  • The extremely low thermal impedance (<0.01 ℃-cm²/W) ensures minimal resistance to heat transfer between surfaces, allowing for efficient thermal management in critical components like CPUs or GPUs.
• Specific Gravity (25℃): 2.9
  • The specific gravity of 2.9 suggests the material is dense and likely contains heavy elements such as aluminum or other metals. This density contributes to its superior thermal performance and stability.
• Useable Temperature Range: -220℃ to 380℃
  • The wide operating temperature range (-220℃ to 380℃) makes this material highly versatile. It can withstand extreme cold and heat, ensuring reliable performance in both industrial and consumer electronics environments.
• Content: 1.5g
  • The 1.5g content provides an adequate amount of material for small to medium-sized applications, such as covering the surface of a processor or other heat-generating components.
• Electrically Conductive: NO
  • Being non-conductive ensures the material is safe to use with sensitive electronic components, as it will not cause electrical shorts or damage to circuits.
• Harmless: YES
  • The material is harmless, meaning it is safe for human handling and does not pose any environmental risks, making it an eco-friendly choice.

Conclusion:

This thermal material is designed for high-performance applications requiring efficient heat transfer and safety. With its exceptional thermal conductivity, low thermal impedance, and wide temperature range, it is ideal for use in modern processors, graphics cards, and other heat-sensitive components. Its non-conductive and harmless properties make it a reliable and safe choice for both professional and consumer electronics.