Thermal Grizzly Intel 13th 14th Generation Delid Die Mate

Thermal Grizzly Intel 13th 14th Generation Delid Die Mate

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Thermal Grizzly Intel 13th 14th Generation Delid Die Mate 

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• Color: Black, Red
• Material: Aluminum
• Socket Manufacturer: Intel
• Socket Type: LGA 1700

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Overview

The Delid-Die-Mate Intel 13th Gen is a specialized tool designed to safely remove the heat spreader (IHS) from Intel processors for socket LGA1700. This process, known as “delidding,” enables advanced cooling techniques such as the Direct Die method , where the CPU cooler is mounted directly onto the processor die. By eliminating the heat spreader, users can achieve significantly improved thermal performance, with potential temperature reductions of 10-15°C when paired with high-performance thermal interface materials like liquid metal.

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Key Features

• Compatibility : Designed for Intel 12th, 13th, and 14th Gen Core processors (LGA1700 socket).
• Material : Constructed from durable aluminium , ensuring stability and precision during the delidding process.
• Purpose : Facilitates the removal of the heat spreader to enable the Direct Die cooling method for enhanced thermal efficiency.
• Soldered Processors : Ideal for Intel’s soldered CPUs (e.g., 13th/14th Gen), where replacing thermal paste is not an option, but direct die cooling can yield significant benefits.

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Why Delidding & Direct Die Cooling?

1. Improved Heat Transfer :
   • Removing the heat spreader allows the CPU cooler to make direct contact with the processor die, reducing thermal resistance and improving heat dissipation.
   • When paired with high-quality thermal interface materials like Conductonaut liquid metal , users can achieve temperature reductions of 10-15°C compared to stock cooling setups.
2. Tested Performance :
   • A test conducted by professional overclocker and Tech-YouTuber Roman “der8auer” Hartung demonstrated the effectiveness of this method on an Intel Core i9-13900K , showcasing measurable thermal improvements.
3. Soldered TIM Limitation :
   • Unlike older unsoldered processors, Intel’s 13th/14th Gen CPUs use indium solder between the die and heat spreader. Replacing this solder is impractical due to the large gap it would create, making delidding for Direct Die cooling the preferred approach.

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Scope of Delivery

• 1x Delid-Die-Mate Tool (Intel 13th Gen) : Precision-engineered for safe and efficient heat spreader removal.

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Important Notes

• Risks of Delidding :
  • Removing the heat spreader (“delidding”) is performed at your own risk and voids the manufacturer’s warranty .
  • Improper handling may result in permanent damage to the CPU, which is not covered by the manufacturer .
• Professional Use Recommended :
  • This tool is intended for experienced users familiar with CPU hardware and cooling modifications.
  • Follow all instructions carefully and ensure proper safety precautions are taken.

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Use Cases

• Enthusiast Builds : Ideal for overclockers and enthusiasts seeking maximum thermal performance from their Intel 13th/14th Gen processors.
• Direct Die Cooling : Enables mounting of CPU coolers directly onto the processor die for optimized heat transfer.
• Custom Modifications : Suitable for advanced users experimenting with alternative cooling methods or thermal interface materials.

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Performance Benefits

• Temperature Reduction : Studies and real-world testing (e.g., by Roman “der8auer”) have shown that combining delidding with liquid metal TIM can reduce CPU temperatures by 10-15°C .
• Enhanced Overclocking Potential : Lower operating temperatures allow for higher sustained clock speeds, improving overall system performance.

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Safety and Warranty Disclaimer

• Warning : Delidding is an advanced procedure that carries inherent risks. Mishandling the tool or the CPU may result in irreparable damage.
• Warranty Void : Removing the heat spreader invalidates the manufacturer’s warranty, and any resulting damage is the user’s responsibility.
• Disclaimer : Always follow the provided instructions and watch instructional videos (if available) to minimize risks.