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Intel Core I7 11700 Processor

7900 EGP

Intel® Core® i7 processor offers more cache space and the hyper-threading architecture delivers high performance for demanding applications with better onboard graphics and faster turbo boost
The processor features Socket LGA-1200 socket for installation on the PCB
Its 16 MB of L3 cache is good enough to carry routine data and process them in a flash giving you fast and smooth performance
14 nm enables improved performance per watt and micro architecture makes it power-efficient
To boost graphics and visual quality, the chipset has a built in Intel UHD Graphics 750 controller

Out Of Stock.

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MODEL	11700
CHIPSET MANUFACTURERS	INTEL
Code Name	Rocket Lake
CPU SERIES	Core I7
CPU Generation	11th Gen
CPU SOCKET	FCLGA1200
CORES	8 Cores
THREADS	16 Threads
OPERATING FREQUENCY	4.90 GHz
MAX TURBO FREQUENCY	4.90 GHz
L2 CACHE	N/A
L3 CACHE	N/A
Technology	DDR4
MEMORY CHANNEL	2
MAX MEMORY SIZE	128 GB
INTEGRATED GRAPHICS	UHD Graphics 750
Part Number	735858477277
Warranty	3 year

INTEL CORE I7 11700 PROCESSOR

CPU Specifications

Total Cores8
Total Threads16
Max Turbo Frequency4.90 GHz
Intel® Turbo Boost Max Technology 3.0 Frequency ^‡4.90 GHz
Intel® Turbo Boost Technology 2.0 Frequency^‡4.80 GHz
Processor Base Frequency2.50 GHz
Cache16 MB Intel® Smart Cache
Bus Speed8 GT/s
TDP65 W

Supplemental Information

Marketing Status Launched
Launch DateQ1’21
Embedded Options Available Not

Memory Specifications

Max Memory Size (dependent on memory type)128 GB
Memory TypesDDR4-3200
Max # of Memory Channels2
Max Memory Bandwidth50 GB/s
ECC Memory Supported ^‡No

Processor Graphics

Processor Graphics ^‡Intel® UHD Graphics 750
Graphics Base Frequency350 MHz
Graphics Max Dynamic Frequency1.30 GHz
Graphics Video Max Memory64 GB
Execution Units32
4K SupportYes, at 60Hz
Max Resolution (HDMI)^‡4096×2160@60Hz
Max Resolution (DP)‡5120 x 3200 @60Hz
Max Resolution (eDP – Integrated Flat Panel)‡5120 x 3200 @60Hz
DirectX* Support12.1
OpenGL* Support4.5
OpenCL* Support3.0
Intel® Quick Sync Video Yes
Intel® In Tru ™ 3D Technology Yes
Intel® Clear Video HD Technology Yes
Intel® Clear Video Technology Yes
# of Displays Supported ^‡3
Device ID0x4C8A

Expansion Options

Scalability1S Only
PCI Express Revision4.0
PCI Express Configurations ^‡Up to 1×16+1×4, 2×8+1×4, 1×8+3×4
Max # of PCI Express Lanes20

Package Specifications

Sockets SupportedFCLGA1200
Max CPU Configuration1
Thermal Solution Specification PCG 2019C
T_JUNCTION100°C
Package Size37.5 mm x 37.5 mm

Advanced Technologies

Intel® Gaussian & Neural Accelerator2.0
Intel® Deep Learning Boost (Intel® DL Boost)Yes
Intel® Optane™ Memory Supported ^‡Yes
Intel® Thermal Velocity Boost No
Intel® Turbo Boost Max Technology 3.0 ^‡Yes
Intel® Turbo Boost Technology ^‡2.0
Intel® Hyper-Threading Technology ^‡Yes
Intel® 64 ^‡Yes
Instruction Set64-bit
Instruction Set Extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512
Idle States Yes
Enhanced Intel Speed Step® Technology Yes
Thermal Monitoring Technologies Yes
Intel® Identity Protection Technology ^‡Yes

Security & Reliability

Intel v Pro ® Eligibility ^‡Intel v Pro® Platform
Intel® AES New Instructions Yes
Secure Key Yes
Intel® Software Guard Extensions (Intel® SGX)No
Intel® OS Guard Yes
Intel® Trusted Execution Technology ^‡Yes
Execute Disable Bit ^‡Yes
Intel® Boot Guard Yes
Intel® Stable IT Platform Program (SIPP)Yes
Intel® Virtualization Technology (VT-x) ^‡Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ^‡Yes
Intel® VT-x with Extended Page Tables (EPT) ^‡Yes

INTEL CORE I7 11700

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Brand

INTEL

INTEL Our Purpose

INTEL We create world-changing technology that improves the life of every person on the planet. put the silicon in Silicon Valley. For more than 50 years,our people have had a profound influence on the world, driving business and society forward by creating radical innovation that revolutionizes the way we live. Today we are applying our reach, scale, and resources to enable our customers to capitalize more fully on the power of digital technology. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges.