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⚡ Engineering Highlights at a Glance:

• High Compressibility: Highly elastic and adaptable surface compensates for even the smallest gaps between components.
• Medium Thermal Conductivity: Ceramic silicon formula with nano aluminum oxide ensures constant, optimal heat transfer.
• Electrical Insulation: Electrically non-conductive design for safe use near exposed circuitry.
• Easy to Use: Flexible pads attach optimally with the lightest touch.
• RoHS Compliant: Eco-friendly and compliant with RoHS standards.
• Multiple Sizes Available: Available in 30x30mm, 120x20mm, and 100x100mm sizes.
• Multiple Thicknesses: Available in 0.5mm, 1mm, 1.5mm, 2mm, and 3mm thicknesses.
• 2-Piece Pack: Includes two 100x100mm pads of 1.0mm thickness.

Thermal Conductivity and Compressibility

The Minus Pad 8 features medium thermal conductivity with a ceramic silicon formula complex and nano aluminum oxide. The highly elastic and adaptable surface ensures constant, optimal heat transfer and compensates for even the smallest gaps between components. The high compressibility makes these pads ideal for applications where component heights vary slightly.

🔧 Application and Preparation

Before application, clean the target surface thoroughly to remove dust, old thermal paste, or thermal pad residue. Cut the pad to the required size using scissors or a sharp blade. Peel off the protective film from one side, apply the pad to the component, then peel off the remaining film before mounting the cooler. The flexible pads attach optimally with the lightest touch. Apply even pressure when mounting the cooler to ensure full contact.

💡 Electrical Insulation and Safety

The Minus Pad 8 is electrically non-conductive, making it safe to use near exposed circuitry without risk of short circuits. This makes it suitable for VRM, VRAM, and other sensitive components. The pads are RoHS-compliant and eco-friendly. Store unused pads in a cool, dry place away from direct sunlight. The 2-piece pack provides ample material for multiple applications or large components.

Before application, clean the target surface thoroughly to remove dust, old thermal paste, or thermal pad residue. Use a ruler and scissors to cut the pad to the required size. The high compressibility of the Minus Pad 8 allows it to compensate for uneven surfaces and height differences between components. Apply the pad with light pressure and avoid stretching or tearing. When mounting the cooler, tighten screws in a diagonal pattern to ensure even pressure. The electrically non-conductive design makes these pads safe for use on VRM, VRAM, and other sensitive components. For best thermal performance, choose a thickness that matches the gap between the component and the cooler, ensuring firm but not excessive compression. Store unused pads in a cool, dry place. The 2-piece pack of 100x100mm pads provides ample material for multiple applications or large components.