Thermal Grizzly Putty Advance 30g Thermal Paste
The Thermal Grizzly Putty Advance 30g Thermal Paste facilitates high-efficiency heat dissipation as an electrically non-conductive alternative to traditional thermal pads. Specifically engineered for professionals who demand flexible gap compensation between PCBs and GPU coolers, it bridges the gap between complexity and reliable performance.
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Why the TG Putty Advance is the Elite Choice for Professionals
Flexible Gap-Filler Architecture
Specifically, TG Putty compensates for technical height differences between components on a PCB. Furthermore, because graphics cards utilize various thermal pad thicknesses, this flexible material eliminates the requirement for multiple pad sizes. Consequently, it provides a technically optimized interface for VRAM and VRM cooling excursions.
Electrically Safe Thermal Transfer
The Advance variant is engineered to be electrically non-conductive to ensure system safety during intensive hardware modifications. Moreover, it maintains good thermal conductivity for critical voltage regulators. This architectural reliability is essential for professionals performing GPU water block conversions or thermal maintenance.
Comprehensive Technical Specifications
| Feature | Detailed Specification |
|---|---|
| Model Name | Thermal Grizzly Putty Advance (PN: TG-P-A-030-R) |
| Net Weight | 30 Grams |
| Material Type | Electrically Non-Conductive Putty |
| Thermal Conductivity | Tier: Good (Optimized for VRM/VRAM) |
| Typical Usage | GPU Memory, Voltage Regulators, Backplates |
| Color | Industrial Grey |
| EAN / UPC | 4260711991202 |
| Warranty | 1 Year Limited Warranty |
⚠️ Technical Caution: Application Prohibitions
- Core Surfaces: Specifically, TG Putty is NOT suitable for use on processor Integrated Heat Spreaders (IHS), Direct Die applications, or directly on the GPU die.
- Preparation: Furthermore, the target technical surface must be thoroughly cleaned and degreased using isopropanol prior to application to ensure architectural integrity of the thermal bond.
FAQ
How much TG Putty is technically required for a standard GPU modification?
Can this putty be reused after removing the cooler?
Is the Advance variant different from TG Putty Pro?
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